مؤتمر
Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions
العنوان: | Wideband RF interconnects for organic chip packages comparison of single ended and differential transitions |
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المؤلفون: | Rohrl, F.X., Jakob, J., Bogner, W., Hageneder, D. |
المصدر: | 2015 European Microwave Conference (EuMC) Microwave Conference (EuMC), 2015 European. :781-784 Sep, 2015 |
Relation: | 2015 European Microwave Conference (EuMC 2015) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9782874870392 |
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DOI: | 10.1109/EuMC.2015.7345880 |