مؤتمر
Evaluation of fan-out wafer level package using 200 °C curable positive-tone photodefinable polybenzoxazoles
| العنوان: | Evaluation of fan-out wafer level package using 200 °C curable positive-tone photodefinable polybenzoxazoles |
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| المؤلفون: | Nishimura, Masato, Toba, Masaya, Matsuie, Noritaka, Motobe, Takeharu, Ohe, Masayuki |
| المصدر: | 2015 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2015 IEEE. :25-28 Nov, 2015 |
| Relation: | 2015 IEEE CPMT Symposium Japan (ICSJ) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781479988143 9781479988136 9781479988150 |
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| DOI: | 10.1109/ICSJ.2015.7357351 |