مؤتمر
Modeling and simulation of heat transfer characteristics of 12-inch wafer on electrostatic chuck
| العنوان: | Modeling and simulation of heat transfer characteristics of 12-inch wafer on electrostatic chuck |
|---|---|
| المؤلفون: | Kuo-Chan Hsu, Jaw-Yen Yang, Jian-Zhang Chen, Yi-Hsiuan Yu, Yen-Ju Chen |
| المصدر: | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015 10th International. :304-307 Oct, 2015 |
| Relation: | 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467396905 9781467383561 9781467383554 |
|---|---|
| DOI: | 10.1109/IMPACT.2015.7365248 |