دورية أكاديمية
Bonding Pad Over Active Structure for Chip Shrinkage of High-Power AlGaN/GaN HFETs
| العنوان: | Bonding Pad Over Active Structure for Chip Shrinkage of High-Power AlGaN/GaN HFETs |
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| المؤلفون: | Oh, S.K., Jang, T., Jo, Y.J., Ko, H., Kwak, J.S. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(2):620-624 Feb, 2016 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2015.2509964 |