مؤتمر
LTCC package for high-bandwidth logic to memory interconnection
| العنوان: | LTCC package for high-bandwidth logic to memory interconnection |
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| المؤلفون: | Chujo, Norio, Uematsu, Yutaka, Takai, Toshiaki, Toyama, Masahiro, Masukawa, Junichi, Yamazaki, Hiroyuki Nagatomo |
| المصدر: | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE. :5-8 Dec, 2015 |
| Relation: | 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467380997 9781467380980 |
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| DOI: | 10.1109/EDAPS.2015.7383661 |