مؤتمر
A methodology to predict the impact of wafer level chip scale package stress on high-precision circuits
| العنوان: | A methodology to predict the impact of wafer level chip scale package stress on high-precision circuits |
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| المؤلفون: | van Dalen, R., Tuinhout, H. P., Stoutjesdijk, M., van Zwol, J., Zaal, J. J. M., Janssen, J. H. J., Swartjes, F. H. M., Bastiaansen, P. A. M., Lammers, M. C., Brusamarello, L., Stekelenburg, M. |
| المصدر: | 2015 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2015 IEEE International. :7.3.1-7.3.4 Dec, 2015 |
| Relation: | 2015 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467398947 9781467398930 |
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| تدمد: | 2156017X |
| DOI: | 10.1109/IEDM.2015.7409646 |