Influence into platen and polishing pad surface temperature on removal rate in sapphire-chemical mechanical polishing

التفاصيل البيبلوغرافية
العنوان: Influence into platen and polishing pad surface temperature on removal rate in sapphire-chemical mechanical polishing
المؤلفون: Matsunaga, Takahiro, Uneda, Michio, Takahashi, Yoshihiro, Shibuya, Kazutaka, Nakamura, Yoshio, Ichikawa, Daizo, Ishikawa, Ken-ichi
المصدر: 2015 International Conference on Planarization/CMP Technology (ICPT) Planarization/CMP Technology (ICPT), 2015 International Conference on. :1-4 Sep, 2015
Relation: 2015 International Conference on Planarization/CMP Technology (ICPT)
قاعدة البيانات: IEEE Xplore Digital Library