مؤتمر
Material and process trends for moving from FOWLP to FOPLP
| العنوان: | Material and process trends for moving from FOWLP to FOPLP |
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| المؤلفون: | Braun, T., Voges, S., Topper, M., Wilke, M., Wohrmann, M., Maas, U., Huhn, M., Becker, K.-F., Raatz, S., Kim, J.-U., Aschenbrenner, R., Lang, K.-D., O'Connor, C., Barr, R., Calvert, J., Gallagher, M., Iagodkine, E., Aoude, T., Politis, A. |
| المصدر: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-6 Dec, 2015 |
| Relation: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781467372695 9781467372688 |
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| DOI: | 10.1109/EPTC.2015.7412348 |