Modeling of cumulative thermo-mechanical stress (CTMS) produced by the shallow trench isolation process for 1 Gb DRAM and beyond

التفاصيل البيبلوغرافية
العنوان: Modeling of cumulative thermo-mechanical stress (CTMS) produced by the shallow trench isolation process for 1 Gb DRAM and beyond
المؤلفون: Tai-Kyung Kim, Do-Hyung Kim, Jae-Kwan Park, Tai-Su Park, Young-Kwan Park, Hoong-Joo Lee, Kang-Yoon Lee, Jeong-Taek Kong, Jong-Woo Park
المصدر: International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217) Electron devices - IEDM 1998 Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International. :145-148 1998
Relation: International Electron Devices Meeting 1998. Technical Digest
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780347749
9780780347748
تدمد:01631918
DOI:10.1109/IEDM.1998.746302