مؤتمر
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
العنوان: | Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices |
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المؤلفون: | Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi-Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, Kuan-Neng Chen, Tu, K. N. |
المصدر: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :27-27 May, 2016 |
Relation: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781509003860 9781509003853 |
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تدمد: | 23806338 |
DOI: | 10.1109/IITC-AMC.2016.7507648 |