Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices

التفاصيل البيبلوغرافية
العنوان: Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
المؤلفون: Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi-Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, Kuan-Neng Chen, Tu, K. N.
المصدر: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :27-27 May, 2016
Relation: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781509003860
9781509003853
تدمد:23806338
DOI:10.1109/IITC-AMC.2016.7507648