مؤتمر
Post porosity plasma protection integration at 48 nm pitch
| العنوان: | Post porosity plasma protection integration at 48 nm pitch |
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| المؤلفون: | Huai Huang, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Lee, Joe, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G, Chao Kun Hu, Huang, Elbert, Canaperi, Donald F, Standaert, Theodorus E, Edelstein, Daniel C., Grill, Alfred, Dubois, Geraud, Bonilla, Griselda |
| المصدر: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :153-155 May, 2016 |
| Relation: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509003860 9781509003853 |
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| تدمد: | 23806338 |
| DOI: | 10.1109/IITC-AMC.2016.7507715 |