مؤتمر
A novel bottom up fill mechanism for the metallization of advanced node copper interconnects
| العنوان: | A novel bottom up fill mechanism for the metallization of advanced node copper interconnects |
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| المؤلفون: | Mevellec, V., Thiam, M., Suhr, D., Religieux, L., Blondeau, P., Chaumont, J.B., Raynal, F. |
| المصدر: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :183-185 May, 2016 |
| Relation: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509003860 9781509003853 |
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| تدمد: | 23806338 |
| DOI: | 10.1109/IITC-AMC.2016.7507725 |