مؤتمر
A novel bottom up fill mechanism for the metallization of advanced node copper interconnects
العنوان: | A novel bottom up fill mechanism for the metallization of advanced node copper interconnects |
---|---|
المؤلفون: | Mevellec, V., Thiam, M., Suhr, D., Religieux, L., Blondeau, P., Chaumont, J.B., Raynal, F. |
المصدر: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International. :183-185 May, 2016 |
Relation: | 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781509003860 9781509003853 |
---|---|
تدمد: | 23806338 |
DOI: | 10.1109/IITC-AMC.2016.7507725 |