مؤتمر
Thermal humidity reliability criterions for a typical TSV device
| العنوان: | Thermal humidity reliability criterions for a typical TSV device |
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| المؤلفون: | Lwo, Ben-Je, Teng, Chia-Liang, Huang, Zi-Yan, Tseng, Kuo-Hao, Tseng, Kun-Fu |
| المصدر: | 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2016 Symposium on. :1-4 May, 2016 |
| Relation: | 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509014576 9781509014583 |
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| DOI: | 10.1109/DTIP.2016.7514850 |