مؤتمر
Fan-Out Packaging of Microdevices Assembled Using Micro-Transfer-Printing
| العنوان: | Fan-Out Packaging of Microdevices Assembled Using Micro-Transfer-Printing |
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| المؤلفون: | Lueck, M., Huffman, A., Hines, P., Lannon, J., Bonafede, S., Trindade, A. J., Bower, C. A. |
| المصدر: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :37-42 May, 2016 |
| Relation: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509012046 |
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| DOI: | 10.1109/ECTC.2016.269 |