مؤتمر
Dynamic Warpage Characterization and Reflow Soldering Defects of BGA Packages
| العنوان: | Dynamic Warpage Characterization and Reflow Soldering Defects of BGA Packages |
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| المؤلفون: | Peng, Kaiqiang, Yang, Weihua, Lai, Linlin, Xu, Wei, Feng, Lei |
| المصدر: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :694-699 May, 2016 |
| Relation: | 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509012046 |
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| DOI: | 10.1109/ECTC.2016.135 |