التفاصيل البيبلوغرافية
| العنوان: |
Breakthrough Packaging Level Shielding Techniques and EMI Effectiveness Modeling and Characterization |
| المؤلفون: |
Hoang, Jimmy-Dinh V., Darveaux, Robert, Lobianco, Tony, Liu, Yi, Nguyen, Wayne |
| المصدر: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1290-1296 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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