التفاصيل البيبلوغرافية
| العنوان: |
Electronic PCB and PKG Thermal Stress Analysis |
| المؤلفون: |
Refai-Ahmed, G., Shi, H., Bhartiya, Y., Pawlak, T., Keshavamurthy, M., Boots, B., Shah, S., Ostergaard, D., Pytel, S. G. |
| المصدر: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1402-1408 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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