التفاصيل البيبلوغرافية
| العنوان: |
Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-Fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs |
| المؤلفون: |
Liu, Fuhan, Kubo, Atsushi, Nair, Chandrasekharan, Ando, Tomoyuki, Furuya, Ryuta, Dwarakanath, Shreya, Sundaram, Venky, Tummala, Rao R. |
| المصدر: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1515-1521 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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