التفاصيل البيبلوغرافية
| العنوان: |
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material |
| المؤلفون: |
Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Liu, Xiao, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan |
| المصدر: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1685-1690 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
Full Text Finder