التفاصيل البيبلوغرافية
| العنوان: |
High Speed Data Acquisition and Pre-Processing System of the Photodetector Linear Array with through-Silicon Vias (TSVs) 2.5D/3D Integration |
| المؤلفون: |
Lu, H. D., Zhang, S. H., Zhang, B., Guo, F. M., Wang, M. J., Wang, W., Shen, J. H. |
| المصدر: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :2305-2310 May, 2016 |
| Relation: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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