مؤتمر
Chip bumping for rework on FCOB assembly line
العنوان: | Chip bumping for rework on FCOB assembly line |
---|---|
المؤلفون: | Yang, Z., Viswanadam, G., Tay, Y.H. |
المصدر: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :25-29 1998 |
Relation: | Proceedings of 2nd Electronics Packaging Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 078035141X 9780780351417 |
---|---|
DOI: | 10.1109/EPTC.1998.755974 |