مؤتمر
Chip bumping for rework on FCOB assembly line
| العنوان: | Chip bumping for rework on FCOB assembly line |
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| المؤلفون: | Yang, Z., Viswanadam, G., Tay, Y.H. |
| المصدر: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :25-29 1998 |
| Relation: | Proceedings of 2nd Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078035141X 9780780351417 |
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| DOI: | 10.1109/EPTC.1998.755974 |