مؤتمر
Measurement on thermal properties of solid films in electronic packages
| العنوان: | Measurement on thermal properties of solid films in electronic packages |
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| المؤلفون: | Shi, X.Q., Pang, H.L.J., Zhou, W., Yang, Q.J. |
| المصدر: | Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) Electronics packaging technology Electronics Packaging Technology Conference, 1998. Proceedings of 2nd. :308-312 1998 |
| Relation: | Proceedings of 2nd Electronics Packaging Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 078035141X 9780780351417 |
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| DOI: | 10.1109/EPTC.1998.756021 |