Reliability study of perpendicular STT-MRAM as emerging embedded memory qualified for reflow soldering at 260°C

التفاصيل البيبلوغرافية
العنوان:	Reliability study of perpendicular STT-MRAM as emerging embedded memory qualified for reflow soldering at 260°C
المؤلفون:	Meng-Chun Shih, Chia-Yu Wang, Yung-Huei Lee, Wayne Wang, Thomas, Luc, Huanlong Liu, Jian Zhu, Yuan-Jen Lee, Guenole Jan, Yu-Jen Wang, Tom Zhong, Torng, Terry, Po-Kang Wang, Derek Lin, Tien-Wei Chiang, Kuei-Hung Shen, Harry Chuang, Gallagher, William J.
المصدر:	2016 IEEE Symposium on VLSI Technology VLSI Technology, 2016 IEEE Symposium on. :1-2 Jun, 2016
Relation:	2016 IEEE Symposium on VLSI Technology
قاعدة البيانات:	IEEE Xplore Digital Library