Integration of neural sensing microsystem with TSV-embedded dissolvable µ-needles array, biocompatible flexible interposer, and neural recording circuits

التفاصيل البيبلوغرافية
العنوان:	Integration of neural sensing microsystem with TSV-embedded dissolvable µ-needles array, biocompatible flexible interposer, and neural recording circuits
المؤلفون:	Huang, Yu-Chieh, Hu, Yu-Chen, Huang, Po-Tsang, Wu, Shang-Lin, You, Yan-Huei, Chen, Jr-Ming, Huang, Yan-Yu, Chang, Hsiao-Chun, Lin, Yen-Han, Duann, Jeng-Ren, Chiu, Tzai-Wen, Hwang, Wei, Chuang, Ching-Te, Chiou, Jin-Chern, Chen, Kuan-Neng
المصدر:	2016 IEEE Symposium on VLSI Technology VLSI Technology, 2016 IEEE Symposium on. :1-2 Jun, 2016
Relation:	2016 IEEE Symposium on VLSI Technology
قاعدة البيانات:	IEEE Xplore Digital Library