Numerical simulation of thermo-mechanical behavior in high power diode laser arrays

التفاصيل البيبلوغرافية
العنوان:	Numerical simulation of thermo-mechanical behavior in high power diode laser arrays
المؤلفون:	Lu, Yao, Nie, Zhiqiang, Zhang, Pu, Wang, Zhenfu, Xiong, Lingling, Wang, Shuna, Wu, Dihai, Liu, Xingsheng
المصدر:	2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :76-83 Aug, 2016
Relation:	2016 17th International Conference on Electronic Packaging Technology (ICEPT)
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	9781509013968
DOI:	10.1109/ICEPT.2016.7583094