مؤتمر
Bonding wire fatigue life prediction of power module in thermal cycling test
| العنوان: | Bonding wire fatigue life prediction of power module in thermal cycling test |
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| المؤلفون: | Guo, Yuanqi, Xu, Yangjian, Liang, Lihua, Liu, Yong |
| المصدر: | 2016 17th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. :482-485 Aug, 2016 |
| Relation: | 2016 17th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509013968 |
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| DOI: | 10.1109/ICEPT.2016.7583180 |