مؤتمر
Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages
العنوان: | Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages |
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المؤلفون: | Prieto, R., Colonna, J. P., Coudrain, P., Chevrier, N., Assigbe, K. N., Cheramy, S., Farcy, A. |
المصدر: | 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2016 22nd International Workshop on. :19-22 Sep, 2016 |
Relation: | 2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781509054503 9781509054510 |
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DOI: | 10.1109/THERMINIC.2016.7748641 |