التفاصيل البيبلوغرافية
العنوان: |
Packaging of high speed 100 Gbps silicon photonic photoreceiver module using 50 µm pitch microbump flip-chip and chip-on-board approach |
المؤلفون: |
Castany, Olivier, Blampey, Benjamin, Temporiti, Enrico, Charbonnier, Benoit, Pares, Gabriel, Germain, Maxime, Borel, Isabelle, Malhouitre, Stephane, Kopp, Christophe, Bernabe, Stephane |
المصدر: |
2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-3 Sep, 2016 |
Relation: |
2016 6th Electronic System-Integration Technology Conference (ESTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |