Packaging of high speed 100 Gbps silicon photonic photoreceiver module using 50 µm pitch microbump flip-chip and chip-on-board approach

التفاصيل البيبلوغرافية
العنوان:	Packaging of high speed 100 Gbps silicon photonic photoreceiver module using 50 µm pitch microbump flip-chip and chip-on-board approach
المؤلفون:	Castany, Olivier, Blampey, Benjamin, Temporiti, Enrico, Charbonnier, Benoit, Pares, Gabriel, Germain, Maxime, Borel, Isabelle, Malhouitre, Stephane, Kopp, Christophe, Bernabe, Stephane
المصدر:	2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-3 Sep, 2016
Relation:	2016 6th Electronic System-Integration Technology Conference (ESTC)
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	9781509014026
DOI:	10.1109/ESTC.2016.7764454