التفاصيل البيبلوغرافية
| العنوان: |
Advanced chip package interaction qualification for critical stacks in combination with Cu pillar interconnect technology |
| المؤلفون: |
Boehme, Bjoern, Goetze, Christian, Dej, Sebastian, Po-Hsiang Wang, Kuechenmeister, Frank, Breuer, Dirk, Paul, Jens, Thiele, Michael |
| المصدر: |
2016 6th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2016 6th. :1-6 Sep, 2016 |
| Relation: |
2016 6th Electronic System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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