التفاصيل البيبلوغرافية
| العنوان: |
Next generation electrolytic copper plating process for HDI applications |
| المؤلفون: |
Jayaraju, Nagarajan, Barstad, Leon, Cleary, Don, Niazimbetova, Zukhra, Liao, Tony, Grand, Caroline, Dziewiszek, Joanna, Rzeznik, Maria, Lin, Marc, Yee, Dennis |
| المصدر: |
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2016 11th International. :52-55 Oct, 2016 |
| Relation: |
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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