مؤتمر
Vertical channel devices enabled by through silicon via (TSV) technologies
| العنوان: | Vertical channel devices enabled by through silicon via (TSV) technologies |
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| المؤلفون: | Kothandaraman, C., Rosenblatt, S., Safran, J., Oldiges, P., Kulkarni-Kerber, P., Xumalo, J., Landers, W., Liu, J., Oakley, J. A., Butt, S., Graves-Abe, T. L., Robson, N., Farooq, M. G., Berger, D., Iyer, S. S. |
| المصدر: | 2016 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2016 IEEE International. :9.6.1-9.6.4 Dec, 2016 |
| Relation: | 2016 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509039029 9781509039012 |
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| تدمد: | 2156017X |
| DOI: | 10.1109/IEDM.2016.7838384 |