دورية أكاديمية
Next Generation IGBT and Package Technologies for High Voltage Applications
| العنوان: | Next Generation IGBT and Package Technologies for High Voltage Applications |
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| المؤلفون: | Kopta, A., Rahimo, M., Corvasce, C., Andenna, M., Dugal, F., Fischer, F., Hartmann, S., Baschnagel, A. |
| المصدر: | IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 64(3):753-759 Mar, 2017 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189383 15579646 |
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| DOI: | 10.1109/TED.2017.2655485 |