Fabric-based fine pitch interconnect technology using anisotropic conductive films(ACFs)

التفاصيل البيبلوغرافية
العنوان: Fabric-based fine pitch interconnect technology using anisotropic conductive films(ACFs)
المؤلفون: Paik, Kyung W.
المصدر: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific. :1-4 Feb, 2017
Relation: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781944543013
9781944543020