Board level reliability of BGA multichip modules

التفاصيل البيبلوغرافية
العنوان: Board level reliability of BGA multichip modules
المؤلفون: Darveaux, Robert, Vijayakumar, Bhuvaneshwaran
المصدر: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific. :1-7 Feb, 2017
Relation: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781944543013
9781944543020