مؤتمر
The investigation of electroplating deposited copper films for advanced VLSI interconnection
| العنوان: | The investigation of electroplating deposited copper films for advanced VLSI interconnection |
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| المؤلفون: | Chen, H.C., Yang, M.S., Wu, J.Y., Lur, W. |
| المصدر: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :65-67 1999 |
| Relation: | Proceedings of the IEEE 1999 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780351746 9780780351745 |
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| DOI: | 10.1109/IITC.1999.787080 |