مؤتمر
Copper-SilK integration in a 0.18 /spl mu/m double level metal interconnect
| العنوان: | Copper-SilK integration in a 0.18 /spl mu/m double level metal interconnect |
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| المؤلفون: | Demolliens, O., Berruyer, P., Morand, Y., Tabone, C., Roman, A., Cochet, M., Assous, M., Feldis, H., Blanc, R., Tabouret, E., Louis, D., Arvet, C., Lajoinie, E., Gobil, Y., Passemard, G., Jourdan, F., Moussavi, M., Cordeau, M., Morel, T., Mourier, T., Ulmer, L., Sicurani, E., Tardif, F., Beverina, A., Trouillet, Y., Renaud, D. |
| المصدر: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :198-199 1999 |
| Relation: | Proceedings of the IEEE 1999 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780351746 9780780351745 |
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| DOI: | 10.1109/IITC.1999.787121 |