مؤتمر
Challenges of aluminum RIE technology at sub 0.45 /spl mu/m pitches [DRAM interconnects]
| العنوان: | Challenges of aluminum RIE technology at sub 0.45 /spl mu/m pitches [DRAM interconnects] |
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| المؤلفون: | Ravikumar, R., Filippi, R.G., Iggulden, R.C., Kiewra, E.W., Kirihata, T., Kitahara, H., Lee, G.Y., Liegl, B., Matsunaga, T., Ning, X.J., Rath, D.L., Stojakovic, G., Weber, S.J. |
| المصدر: | Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) Interconnect technology Interconnect Technology, 1999. IEEE International Conference. :203-205 1999 |
| Relation: | Proceedings of the IEEE 1999 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780351746 9780780351745 |
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| DOI: | 10.1109/IITC.1999.787122 |