مؤتمر
Characterization of epoxy based highly filled die attach materials in microelectronics
| العنوان: | Characterization of epoxy based highly filled die attach materials in microelectronics |
|---|---|
| المؤلفون: | Maus, I., Liebl, C., Fink, M., Vu, D.-K., Hartung, M., Preu, H., Jansen, K.M.B., Michel, B., Wunderle, B., Weiss, L. |
| المصدر: | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-7 Apr, 2017 |
| Relation: | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509043446 9781509043439 |
|---|---|
| DOI: | 10.1109/EuroSimE.2017.7926237 |