مؤتمر
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
العنوان: | In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging |
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المؤلفون: | Khalilullah, I., Reza, T., Chen, L., H. Mazumder, A.K.M.M., Fan, J., Qian, C., Zhang, G., Fan, X. |
المصدر: | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-9 Apr, 2017 |
Relation: | 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781509043446 9781509043439 |
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DOI: | 10.1109/EuroSimE.2017.7926275 |