التفاصيل البيبلوغرافية
| العنوان: |
In Depth Analysis of 3D NAND Enablers in Gate Stack Integration and Demonstration in 3D Devices |
| المؤلفون: |
Tan, C.-L., Lavizzari, S., Blomme, P., Breuil, L., Vecchio, G., Sebaai, F., Paraschiv, V., Tao, Z., Schepers, B., Nyns, L., Peter, A., Dekkers, H., Ong, P., Tsvetanova, D., Devriendt, K., Teugels, L., Heylen, N., Raymaekers, T., Jossart, N., Mennella, P., Delhougne, R., V-Palayam, S.S., Arreghini, A., Van den bosch, G., Furnemont, A. |
| المصدر: |
2017 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2017 IEEE International. :1-4 May, 2017 |
| Relation: |
2017 IEEE International Memory Workshop (IMW) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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