مؤتمر
Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced package
العنوان: | Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced package |
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المؤلفون: | Chen, Yu-Hua, Lin, Puru Bruce, Ko, Cheng-Ta, Tseng, Tzyy-Jang |
المصدر: | 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :16-18 Apr, 2017 |
Relation: | 2017 International Conference on Electronics Packaging (ICEP) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784990218836 9784990218829 |
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DOI: | 10.23919/ICEP.2017.7939313 |