مؤتمر
Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced package
| العنوان: | Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced package |
|---|---|
| المؤلفون: | Chen, Yu-Hua, Lin, Puru Bruce, Ko, Cheng-Ta, Tseng, Tzyy-Jang |
| المصدر: | 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :16-18 Apr, 2017 |
| Relation: | 2017 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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