مؤتمر
Electroplating for the Ni probe tip
| العنوان: | Electroplating for the Ni probe tip |
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| المؤلفون: | Kim, N.G., Sun, Y.-B. |
| المصدر: | 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :33-34 Apr, 2017 |
| Relation: | 2017 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784990218836 9784990218829 |
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| DOI: | 10.23919/ICEP.2017.7939319 |