مؤتمر
Al-Al wafer-level thermocompression bonding applied for MEMS
| العنوان: | Al-Al wafer-level thermocompression bonding applied for MEMS |
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| المؤلفون: | Taklo, M.M. Visser, Schjolberg-Henriksen, K., Malik, N., Poppe, E., Moe, S.T., Finstad, T.G. |
| المصدر: | 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :11-11 May, 2017 |
| Relation: | 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784904743034 9784904743058 |
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| DOI: | 10.23919/LTB-3D.2017.7947407 |