Effects of electromagnetic radiation exposure on direct Cu bonding

التفاصيل البيبلوغرافية
العنوان: Effects of electromagnetic radiation exposure on direct Cu bonding
المؤلفون: Song, J.-M., Liang, S.-Y., Chiang, P.-H., Huang, S.-K., Chiu, Y.-T., Tarng, D., Hung, C.-P.
المصدر: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :43-43 May, 2017
Relation: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9784904743034
9784904743058
DOI:10.23919/LTB-3D.2017.7947439