مؤتمر
Effects of electromagnetic radiation exposure on direct Cu bonding
العنوان: | Effects of electromagnetic radiation exposure on direct Cu bonding |
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المؤلفون: | Song, J.-M., Liang, S.-Y., Chiang, P.-H., Huang, S.-K., Chiu, Y.-T., Tarng, D., Hung, C.-P. |
المصدر: | 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :43-43 May, 2017 |
Relation: | 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784904743034 9784904743058 |
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DOI: | 10.23919/LTB-3D.2017.7947439 |