Study of the influence of process parameters on gate oxide degradation during contact etching in MERIE and HDP reactors

التفاصيل البيبلوغرافية
العنوان: Study of the influence of process parameters on gate oxide degradation during contact etching in MERIE and HDP reactors
المؤلفون: Poiroux, T., Pascal, F., Heitzmann, M., Berruyer, P., Turban, G., Reimbold, G.
المصدر: 1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) Plasma process-induced damage Plasma Process-Induced Damage, 1999 4th International Symposium on. :12-15 1999
Relation: 1999 4th International Symposium on Plasma Process-Induced Damage
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0965157733
9780965157735
DOI:10.1109/PPID.1999.798797