مؤتمر
Epoxy molding compound effect on fan-out wafer level package strength during post-mold thermal process
| العنوان: | Epoxy molding compound effect on fan-out wafer level package strength during post-mold thermal process |
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| المؤلفون: | Xu, Cheng, Zhong, Z. W., Choi, W. K. |
| المصدر: | 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. :1388-1392 May, 2017 |
| Relation: | 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509029945 9781509029938 |
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| DOI: | 10.1109/ITHERM.2017.7992643 |