Novel integration technology with capacitor over metal (COM) by using self-aligned dual damascene (SADD) process for 0.15 /spl mu/m stand-alone and embedded DRAMs

التفاصيل البيبلوغرافية
العنوان: Novel integration technology with capacitor over metal (COM) by using self-aligned dual damascene (SADD) process for 0.15 /spl mu/m stand-alone and embedded DRAMs
المؤلفون: Won Suk Yang, Yeong Kwan Kim, Soo Ho Shin, Won Seok Lee, Kyu Hyun Lee, Hong Sik Jeong, Jong Ho Lee, Tae Young Chung, Heung Soo Park, Sang In Lee, Kinam Kim, Moon Yong Lee, Chang Gyu Hwang
المصدر: 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325) VLSI technology VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on. :13-14 1999
Relation: 1999 Symposium on VLSI Technology. Digest of Technical Papers
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:493081393X
9784930813930
DOI:10.1109/VLSIT.1999.799316