التفاصيل البيبلوغرافية
| العنوان: |
Key process steps for high performance and reliable 3D Sequential Integration |
| المؤلفون: |
Lu, C.-M. V., Deprat, F., Fenouillet-Beranger, C., Batude, P., Garros, X., Tsiara, A., Leroux, C., Gassilloud, R., Nouguier, D., Ney, D., Federspiel, X., Besombes, P., Toffoli, A., Romano, G., Rambal, N., Delaye, V., Barge, D., Samson, M.-P., Previtali, B., Tabone, C., Pasini, L., Brunet, L., Andrieu, F., Micoud, J., Skotnicki, T., Vinet, M. |
| المصدر: |
2017 Symposium on VLSI Technology VLSI Technology, 2017 Symposium on. :T226-T227 Jun, 2017 |
| Relation: |
2017 Symposium on VLSI Technology |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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