First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration

التفاصيل البيبلوغرافية
العنوان:	First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration
المؤلفون:	Shi, Tailong, Buch, Chintan, Smet, Vanessa, Sato, Yoichiro, Parthier, Lutz, Wei, Frank, Lee, Cody, Sundaram, Venky, Tummala, Rao
المصدر:	2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :41-46 May, 2017
Relation:	2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library